Alkoxysilane/organic polymer composition for thin insulating film production and use thereof
US6448331B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1999 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Nov 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an alkoxysilane/organic polymer composition for use in producing an insulating thin film, comprising (A) a specific alkoxysilane; (B) a specific organic polymer; and (C) a solvent for alkoxysilane (A) and organic polymer (B), wherein solvent (C) comprises at least one organic solvent selected from the group consisting of amide linkage-containing organic solvents and ester linkage-containing organic solvents. Also disclosed are a silica-organic polymer composite thin film which is produced by a process comprising: forming a thin film of the composition of the present invention; subjecting the thin film to a hydrolysis and dehydration-condensation reaction with respect to the alkoxysilane thereof, to thereby cause the alkoxysilane to be gelled in the thin film; and removing the solvent remaining in the thin film by drying, and a porous silica thin film which is obtained by removing the organic polymer from the silica-organic polymer composite thin film. Both of the silica-organic polymer composite thin film and the porous silica thin film have advantages not only in that these thin films have a low dielectric constant suitable for insulating layers for a multilevel inter…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.