Polyolefin resin composition
US6448357B1 · kind B1 · utility
8Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Sep 28, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/526
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyolefin resin composition comprising (A) an ethylene-based polyolefin having a density of 0.865 to 0.980 g/cm3 and MFR of 0.01 to 50 g/10 min, (B) a phosphorous compound, and (C) at least one heat stabilizer selected from the group consisting of a phenol-based heat stabilizer and a tocopherol-based heat stabilizer. The polyolefin resin composition has excellent heat resistance, moisture resistance and discoloration resistance, and also when used as a packaging material, does not impair the taste of contents to be packaged, such as flavor or odor, and therefore does not impair the taste of the contents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.