Method and apparatus for laser cutting materials
US6448534B1 · kind B1 · utility
14Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 19, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Jan 12, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method and apparatus of cutting an object with a laser beam, comprising using a diode laser-pumped pulsed solid state laser having an average power output from about 2 to about 100 watts and delivering an average laser beam brightness of greater than 1012 W/m2*sr and a peak brightness of greater than 1013 W/m2*sr to the object. Objects cut with the laser cutting method having heat affected zones (HAZ) of less than 4 mm, and having substantially no microcracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.