Method and apparatus for wafer-level testing of semiconductor lasers
US6448805B1 · kind B1 · utility
9Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2001 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Mar 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0014
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and device for wafer level testing of semiconductor lasers allows probing from one side while detecting light output from the opposite side. A chuck with a transparent substrate receives the optical aperture side of a wafer of semiconductor lasers. The wafer is probed form the side opposite the side contacting the chuck and emitted light is detected on a side of the chuck opposite the side contacting the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.