Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof
US6449156B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2001 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Sep 12, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C5/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A novel heat sink structure for being mounted to a module board to which semiconductor chips are attached and for dissipating or spreading heat generated from the semiconductor chips is disclosed. The heat sink comprises a heat sink base, and a coupling means for coupling the heat sink base to the module board. The coupling means passes through the heat sink base. The coupling means includes integrally formed upper and lower body portions, an orifice formed at least through the lower body portion, and a flanged base formed integral with the lower body portion. The flanged base fixes the coupling means to the heat sink base. The outer dimension of the upper body portion is smaller than the inner dimension of the lower body portion. As a result, many heat sinks can be stacked stably.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.