Inboard retention system for processor enclosure assemblies with substrate alignment
US6449163B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1998 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Jun 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A retention mechanism which may include a pair of flexible tabs. The flexible tabs may be pressed into opposing side edges of a substrate which supports an integrated circuit package. The substrate may be part of an electronic cartridge which has a cover. The flexible tab may extend through a space between the substrate and the cover such that the retention mechanism has a profile that is no greater than the cartridge. The retention mechanism may be mounted to a motherboard. The motherboard may have a connector that receives the substrate. An insertion tool can be used to plug the cartridge into the connector and couple the flexible tab to the substrate. An extraction tool can be used to pull the cartridge out of the connector and separate the substrate from the flexible tabs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.