Electrical interconnecting device for a semiconductor assembly
US6449165B1 · kind B1 · utility
1Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2000 |
| Grant date | Sep 10, 2002 |
| Priority date | — |
| Expiry date | Apr 5, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0466
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test socket connecting an integrated circuit chip to a printed circuit board is disclosed. The test socket includes a horizontal upper portion connected to the integrated circuit chip, a horizontal lower portion connected to the printed circuit board, and an intermediate portion connected between the horizontal upper portion and the horizontal lower portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.