High-precision pressure sensor
US6450038B1 · kind B1 · utility
4Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2000 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Oct 17, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor, particularly for use in extruders of plastic materials, having an outer enclosure containing a supporting element for a semiconductor chip which is provided with a strain-gauge on one of opposite faces of the chip, a covering element in order to close the enclosure, a mechanical transmission element accommodated in the covering element, directed toward the semiconductor chip and in contact with the chip, the semiconductor chip being accommodated so as to float in the supporting element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.