Method for making weldless magnesium/aluminum bonded components
US6450396B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 2, 2001 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Jul 2, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of joining at least a portion of a first substrate with at least a portion of a second substrate. The first substrate includes at least 90 weight percent aluminum and a first set of additives wherein magnesium is the dominant constituent in the additives. The second substrate includes at least 85 weight percent magnesium and a second set of additives wherein aluminum is the dominant constituent of the second set of additives. The first and second substrates are heated to an elevated temperature ranging from about 440° C. to 500° C. Pressure is applied to the first and second substrates at least at one point of contact to bond the first and second substrates together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.