Process for the chemical treatment of semiconductor wafers
US6451124B1 · kind B1 · utility
2Cited by
12References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2001 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Jun 15, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers, is such that the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.