RFID manufacturing concepts
US6451154B1 · kind B1 · utility
205Cited by
19References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2000 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Feb 18, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Radio frequency identification labels are made in a high speed and effective manner in a variety of different ways utilizing a number of different sources of RFID inlets, each inlet including an antenna and a chip. A plurality of webs are matched together and RFID labels are die cut from the webs, to produce lined RFID labels. Alternatively linerless RFID labels are produced from a composite web with a release material on one face and pressure sensitive adhesive on the other, the labels formed by perforations in the web.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.