Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
US6451185B2 · kind B2 · utility
10Cited by
27References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2001 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Jul 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.