Heat conductive resin substrate and semiconductor package
US6451418B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 22, 2000 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Mar 22, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31623
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a heat conductive resin substrate which polybenzasol fibers are oriented in a thick direction and/or a direction of a surface of a resin substrate, further to the heat conductive resin substrate and a semiconductor package excellent in heat radiation ability which the semiconductor chips are mounted on the heat conductive resin substrate which the polybenzasol fibers are oriented in the thick direction (the Z direction) and/or the direction of the surface of the resin substrate, the heat conductive resin substance and the semiconductor package being provided with electrical insulation and high thermal conductivity, and being capable of controlling the thermal expansion coefficient.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.