Thermal interface materials
US6451422B1 · kind B1 · utility
47Cited by
3References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 1, 1999 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Dec 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/653
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Described is an interface material composition that includes rubber, phase change material and thermally conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.