Patent · US Expired

Photosensitive composition

US6451498B1 · kind B1 · utility

13Cited by
7References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 6, 2000
Grant dateSep 17, 2002
Priority date
Expiry dateApr 6, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S430/111
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The invention relates to photosensitive compositions, which can be developed positively. Traditional compositions have either inadequate photosensitivity or they are not appropriate for use on the copper surfaces, for example of circuit boards, since the exposed coating sections of the composition cannot be completely removed during developing, which results in problems in subsequent plating or etching. In the photosensitive compositions according to the invention, these disadvantages cannot be observed. Various compositions are described, which contain photo acid generators and a polymer resin with side groups, which can split acid, said polymer resin being formed by polymerizing at least three different acrylate- or methacrylate-monomers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.