Method of manufacturing multi-layer printed wiring board
US6451710B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2001 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Jun 7, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing highly reliable and highly dense printed wiring board which is not warped even by the application of pressure and heat in manufacturing the multi-layer printed wiring board. The highly precise and highly dense multi-layer printed wiring board is realized by using an uncured resin sheet reinforced with fiber as an interlayer insulating layer, forming non-through holes in the uncured resin sheet using a laser beam, filling the non-through holes with a conductive paste, half-curing the conductive paste to form a wiring material, and sticking the wiring material onto the wiring substrate by application of pressure and heat, without causing a deviation in position even in applying pressure and heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.