High molecular weight epoxy resin and resinous composition for printed circuit board
US6451878B1 · kind B1 · utility
11Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2000 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Nov 2, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/93
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.