Ultra-thin composite surface finish for electronic packaging
US6452258B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2000 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Nov 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention, a packaged electronic device comprises at least one electronic device and leads sealed within a protective package. The leads comprise a conductive metal substrate having a composite metal finish with a total thickness of 1000 å or less. The finish comprises, in succession from the substrate, 25-750 å of palladium alloy and 5-250 å of wirebondable and solderable material. The substrate is advantageously nickel-plated copper alloy or Fe—Ni alloy. The content of palladium in the palladium alloy coating can range from 10-95 weight percent. This finish meets requirements of wirebonding and solderability at a thickness surprisingly lower than previously used packaging finishes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.