Flat semiconductor device and power converter employing the same
US6452261B1 · kind B1 · utility
10Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1999 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Sep 7, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control electrode wirings from main electrode wirings are also given function of positioning of the respective semiconductor chips in the flat package. Further, a one-piece control electrode wiring net is housed in the common electrodes of the package and the electrodes which are led out from the control electrodes of the respective semiconductor chips are connected to the net to simplify the processing of a large number of gate signal wirings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.