Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus
US6452264B2 · kind B2 · utility
4Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2001 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Mar 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/017
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.