Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods
US6452798B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2001 |
| Grant date | Sep 17, 2002 |
| Priority date | — |
| Expiry date | Sep 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an electronic module includes forming a cooling substrate having a fluid cooling circuit therein having a vertical passageway. The cooling substrate may be formed by forming a plurality of unsintered ceramic layers having passageways therein. The plurality of unsintered ceramic layers and at least one resistive element may be assembled in stacked relation so that the passageways align to define the fluid cooling circuit and so that the at least one resistive element extends in a cantilever fashion into the vertical passageway. Furthermore, the unsintered ceramic layers and the at least one resistive element may be heated to sinter and to cause the at least one resistive element to soften and deform downwardly adjacent vertical sidewall portions of the vertical passageway. The method may also include mounting at least one electronic device on the cooling substrate in thermal communication with the fluid cooling circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.