Rubber stamp positioning device
US6453573B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 14, 2001 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | May 14, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41K1/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides for a stamp alignment device for use with a stamp having a height comprised of a base having first and second stamp guide edges. The first stamp guide edge and the second stamp guide edge connect in a substantially perpendicular manner creating an angled receiving area. At least one portion of each of the stamp guide edges is substantially higher than the height of the stamp mount. The stamp alignment device further comprises a non-slip surface attached to the bottom of the base and has a thickness. The non-slip surface has first and second non-slip surface guide edges that correspond to the first and second stamp guide edges of the base. Additionally, an image sheet is provided having a thickness less than the thickness of the non-slip surface. The image sheet has at least one substantially right angled corner configured to be placed into the first and second non-slip surface guide edges. Thus, when the image sheet is placed along the first and second non-slip surface guide edges, and the stamp is placed along the first and second stamp guide edges and pressed onto the image sheet, a reference image is deposited on the image sheet so that the image s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.