Device and process for thermal analysis of molten metals
US6454459B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Oct 6, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/205
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for thermal analysis of molten metals comprising two thermocouples is described. It comprises a mould (1) with a spherical cavity (2), the one thermocouple (3) being placed such that it extends over the central portion of the cavity (2), a cylindrical duct (5) which communicates with the cavity (2) and a cylindrical part (7) which communicates with the lower portion of the cavity (2), the other thermocouple (6) being placed in the transition between the cavity (2) and the cylindrical part (7). A process for thermal analysis of molten metals with the aid of the device is also described. The difference in temperature (11) in the temperature/time curve for the thermocouple which is centrally placed and the lower themocouple which is peripherally placed when the solidus temperature determined by means of the centrally placed thermocouple (3) has been reached is used as a measure of the thermal conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.