Optoelectronic interconnect module
US6454470B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Dec 12, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4214
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic interconnect module comprising a housing having a first aperture on a first side of the housing for receiving an optical ferrule and a second aperture on a second side of the housing for receiving a semiconductor die. A mirror is mounted within the housing at an angle for reflecting optical transmissions between the first and second apertures. A first optical lens is mounted between the first aperture and the mirror, and a second optical lens is mounted between the second aperture and the mirror. The optoelectronic interconnect module transmits an electronically modulated optical signal between an optical fiber in the first aperture and an optoelectronic semiconductor die adjacent to the second aperture within a mutually orthogonal plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.