Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
US6454819B1 · kind B1 · utility
52Cited by
2References
37Claims
0Family size
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Key dates
| Filing date | Jan 18, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Jan 18, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/013
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite particles, the composite particles containing polymer particles having at least one of a silicon compound portion or section and a metal compound portion or section formed directly or indirectly on the polymer particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.