Method and apparatus for up to full width ultrasonic bonding
US6454890B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Mar 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Bonding apparatus and methods for creating up to full-width ultrasonic bonds in an advancing web. The bonding apparatus comprises a first nip, defined by, in combination, a first set of bonding elements comprising a first rotary ultrasonic horn and a first rotary anvil, and first engagement apparatus bringing the first horn and first anvil into effective bonding engagement with each other. The first horn and anvil being supported from support structure and rotating in common with each other thereby to convey the web through the first nip. The bonding apparatus also comprises a second nip, defined by a second set of bonding elements comprising second separate and distinct horn and anvil, and second engagement apparatus bringing the second horn and second anvil into effective bonding engagement with each other. The first and second sets of bonding elements are cooperatively disposed at first and second separate and distinct work stations spaced along the length of the operations path, and are preferably disposed at respective first and second different locations across the width of the operations path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.