Impregnating, casting and coating compounds for electrotechnical and/or electronic components and for carrier materials for plane insulating materials

US6455111B1 · kind B1 · utility

Assignee

• Schenectady International Inc. · US

Inventors

• Rainer Blum · Ludwigshafen, DE
• Manfred Eichhorst · Oststeinbek, DE
• Gunther Hegemann · Hamburg, DE
• Klaus-Wilhelm Lienert · Hamburg, DE

Key dates

• Filing date: Feb 2, 2000
• Grant date: Sep 24, 2002
• Expiry date: Feb 2, 2020

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P20/582
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The subject of the present invention is the use of a resin composition (A) comprisingA1) at least one unsaturated polyester resin,A2) at least one vinyl ether having a viscosity of less than 4000 mPa·s at 25° C.,A3) if desired, at least one further polymer and/or oligomer,A4) if desired, at least one curing accelerator,A5) if desired, at least one ethylenically unsaturated reactive diluent, andA6) if desired, further customary additives,as impregnating, casting and coating compositions for electrical and/or electronic components and for carrier materials for sheetlike insulating materials.The present invention additionally relates to coating compositions suitable for this purpose which can be cured with low emissions.