Multi-layer oriented heat sealable film structure of improved machinability
US6455150B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Dec 9, 1993 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Dec 9, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat-sealable multilayer film comprising: (a) an upper heat-sealable layer comprising (I) an ethylene polymer, copolymer, or terpolymer and (ii) a particulate, crosslinked hydrocarbyl-substituted polysiloxane having a mean particle size of from about 0.5 &mgr;m to about 20.0 &mgr;m, as a combined slip agent and antiblocking agent; (b) an intermediate core layer comprising a propylene polymer; and (c) a lower heat-sealable layer consisting essentially of (I) an ethylene polymer, copolymer, or terpolymer, (ii) a particulate, crosslinked hydrocarbyl-substituted polysiloxane having a mean particle size of from about 0.5 &mgr;m to about 20.0 &mgr;m, as a combined slip agent and antiblocking agent; and (iii) from about 0.15 wt% to about 1.5 wt% of a liquid, hydrocarbyl-substituted polysiloxane. The upper heat-sealable sealable layer does not contain a liquid polysiloxane, but may have a coating of liquid polysiloxane transferred from the lower heat-sealable layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.