Metallic substrates for high temperature superconductors
US6455166B1 · kind B1 · utility
15Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | May 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A biaxially textured face-centered cubic metal article having grain boundaries with misorientation angles greater than about 8° limited to less than about 1%. A laminate article is also disclosed having a metal substrate first rolled to at least about 95% thickness reduction followed by a first annealing at a temperature less than about 375° C. Then a second rolling operation of not greater than about 6% thickness reduction is provided, followed by a second annealing at a temperature greater than about 400° C. A method of forming the metal and laminate articles is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.