Integrated inductive circuits
US6455915B1 · kind B1 · utility
24Cited by
16References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 17, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Aug 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated inductive element may be formed over a substrate. A trench may be defined in a variety of shapes in the substrate beneath the integrated inductive element in order to reduce eddy current losses arising from magnetic coupling between integrated inductors associated with the same integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.