Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US6455930B1 · kind B1 · utility
60Cited by
20References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Sep 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02484
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.