Integrated circuit assembly having interposer with a compliant layer
US6455936B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2001 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | May 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0133
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit assembly includes a base board, an interposer, and an array of solder balls electrically and structurally interconnecting the interposer and the base board. The interposer has a backbone layer having a backbone stiffness, a first compliant layer affixed to the backbone layer between the backbone layer and the integrated circuit and having a first-layer stiffness of less than the backbone stiffness, and a second compliant layer affixed to the backbone layer between the backbone layer and the base board and having a second-layer stiffness of less than the backbone stiffness. An integrated circuit is supported on the interposer. The integrated circuit includes integrated-circuit bonding pads thereon and a bonding pad protective coating overlying the integrated-circuit bonding pads. An electrical interconnect extends from the integrated circuit to at least one of the solder balls, and a cover overlies and protects the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.