Multilayered ceramic RF device
US6456172B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Oct 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A multilayered ceramic RF device having at least one radio frequency filter includes a low temperature-cofired multilayered ceramic body having a plurality of ceramic layers laminated one upon another and fired together. The low temperature-cofired multilayered ceramic body also has a first electrode pattern formed therein and a second electrode pattern formed thereon. The first and second electrode patterns are electrically connected to one another through a via hole. A bare semiconductor chip is mounted on the low temperature-cofired multilayered ceramic body with a face down bonding, and the bare semiconductor chip is coated with a sealing resin. The at least one radio frequency filter is a multilayered filter formed in the low temperature-cofired multilayered ceramic body, and the multilayered filter includes a part of the first and second electrode patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.