High-frequency semiconductor laser module
US6456641B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1999 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Oct 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/06226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention is directed to a high-frequency semiconductor laser module with a silicon substrate, especially made of low-impedance silicon, a laser diode arranged thereon, and at least two lines for the H-F feed, one of which is insulated from the silicon substrate by a dielectric layer. According to the invention, the laser diode is arranged on the silicon substrate via a metallic mounting layer, and the H-F line is guided close to the laser diode on the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.