Optoelectronic packaging
US6456766B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2000 |
| Grant date | Sep 24, 2002 |
| Priority date | — |
| Expiry date | Feb 1, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Packaging of micromechanical and microelectromechanical devices is carried out by mechanical couplers for connecting pairs or arrays of optical fibers in end-to-end alignment. In another embodiment, a coupler interconnects one or more optical components on a substrate. The electrical components may be active elements such as light sources or light sensors, while the optical components may be waveguides. The fibers are secured in a coupler block, and a substrate carrying the light detector or light source is mounted on or in the block and is secured in alignment with the fibers. The fibers are removably secured within the block by spring fingers.The coupler block may include electrical circuitry connectable to the sensors or light sources on the substrate mounted on the block through wire bonding techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.