Two-layered micro channel heat sink, devices and systems incorporating same
US6457515B1 · kind B1 · utility
133Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1999 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Aug 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention includes heat sinks, heat sink devices, and heat sink systems. The invention also includes machines or electronic devices using these aspects of the invention. The present invention also includes in broadest terms, an electronic device in thermal contact with a two-layered micro-channeled heat sink device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.