Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls
US6457633B1 · kind B1 · utility
27Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1999 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Mar 24, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a semiconductor device mounts solder balls on a resin board which has holes formed therethrough and conductive sheets formed therebeneath to cover bottom ends of the holes. The method includes the steps of applying solder paste on the holes, melting the solder paste by heat to make solder of the solder paste flow into the holes and establish contact with the conductive sheets, and connecting the solder balls to the solder filled in the holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.