Slurry recirculation in chemical mechanical polishing

US6458020B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Jeffrey A. Brigante · Colchester, US
• Thomas L. Conrad · Beaverton, US
• David J. Fontaine · Williston, US
• Rock Nadeau · Jericho, US
• Paul Smith · Fort Collins, US
• Theodore G. van Kessel · Millbrook, US

Key dates

• Filing date: Nov 16, 2001
• Grant date: Oct 1, 2002
• Expiry date: Nov 16, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B57/02
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A recirculation mechanism is used to force slurry toward the center of a platen used for chemical-mechanical polishing. The recirulator captures the slurry that would otherwise be flung from a rotating platen because of centrifugal force. The captured slurry is forced upwardly away from the surface of the platen and toward the center of the platen to recycle the slurry.