Method of fabricating micromachined structures and devices formed therefrom
US6458615B1 · kind B1 · utility
46Cited by
12References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1999 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Sep 30, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/084
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating a micromachined structure. The method includes forming a circuitry layer having an upper etch-resistant layer on an upper surface of a substrate, directionally etching a portion of the circuitry layer exposed by the upper etch-resistant layer, and directionally etching a portion the substrate exposed by the upper etch-resistant layer with a deep reactive ion etch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.