Controlled-stress stable metallization for electronic and electromechanical devices
US6458698B2 · kind B2 · utility
1Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2001 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Jul 17, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0828
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming a thin film metallization layer having a predetermined residual stress and a predetermined sheet resistance and force measuring devices formed using the methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.