Patent · US Expired

Ethylene polymer film resins

US6458911B1 · kind B1 · utility

8Cited by
18References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 2, 2001
Grant dateOct 1, 2002
Priority date
Expiry dateOct 2, 2021

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2314/02
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A class of relatively high molecular weight, high density ethylene polymers (HMW-HDPE) is disclosed capable of being formed into thin films of high strength, such polymers having a density of at least about 0.925 g/cc, a flow index (I21) no higher than about 15 g/10 min., a melt flow ratio (MFR) of at least about 65, and a dynamic elasticity at 0.1 rad./sec. of no higher than about 0.7 at a corresponding complex viscosity at 0.1 rad./sec. no higher than about 14×105 poises. The ethylene polymer is a bimodal of relatively high molecular weight (HMW) and low molecular weight (LMW) ethylene polymers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.