Flexible multilayer wiring board
US6459044B2 · kind B2 · utility
35Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2001 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a flexible multilayer wiring board, a first conductive pattern provided on a first flexible base material and a second conductive pattern provided on a second flexible base material are made to conduct via a first conductive body filled in a first through hole. Hereby, a flexible multilayer wiring board of which the productivity is satisfactory, which is low-priced and highly reliable in connection can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.