Thermal chimney for a computer
US6459577B1 · kind B1 · utility
48Cited by
11References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2001 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Jul 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat removal system for a computer comprising a casing enclosing a hard drive and a microprocessor, the casing including an opening in an exterior surface thereof; a heat sink positioned between the hard drive and the microprocessor, the heat sink being aligned with the opening in the casing so as to form a thermal chimney; and a spreader plate disposed between the microprocessor and the heat sink, the spreader plate conducting heat from the microprocessor to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.