Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
US6459582B1 · kind B1 · utility
49Cited by
22References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2000 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Jul 19, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/477
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device (“chip”). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.