Single board power supply with thermal conductors
US6459586B1 · kind B1 · utility
19Cited by
12References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2000 |
| Grant date | Oct 1, 2002 |
| Priority date | — |
| Expiry date | Aug 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power supply module for a computer is provided. The module includes a multilayer pc board, heat generating electrical components disposed on the board, logic elements disposed on the board and a heat sink. The module also includes thermal conducting structure disposed coupled to the pc board and thermally coupled to the heat sink and to the heat generating electrical components for transferring heat from the heat generating electrical components to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.