Packaging system for two-dimensional optoelectronic arrays

US6459842B1 · kind B1 · utility

Assignee

• Teraconnect, Inc. · US

Inventors

• Barry R. Arsenault · Burlington, US
• Jason Bundas · Merrimack, US
• Mani Sundaram · Nashua, US
• Rick C. Thompson · Cedar Park, US
• Alan E. Tobey · Billerica, US
• Richard Williams · Princeton, US

Key dates

• Filing date: Dec 13, 2001
• Grant date: Oct 1, 2002
• Expiry date: Dec 13, 2021

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4292
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The present invention features a packaging system for two-dimensional optoelectronic arrays. In one embodiment, the packaging includes a heat spreader, a housing with embedded electrical interconnections, a substrate including electrical contacts, an application specific integrated circuit (ASIC) including a hybridized array with vertical cavity surface emitting laser (VCSEL), detectors or both. The waveguide assembly includes a plurality of individual one-dimensional waveguides formed in waveguide sheets, wherein the waveguides match the array footprint on one end and a connector footprint on the other end.