Wiring board constructions and methods of making same
US6460247B1 · kind B1 · utility
9Cited by
8References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 1999 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Dec 21, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.