Patent · US Expired

Heat transfer device with a self adjusting wick and method of manufacturing same

US6460612B1 · kind B1 · utility

21Cited by
4References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 12, 2002
Grant dateOct 8, 2002
Priority date
Expiry dateFeb 12, 2022

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF28D15/046
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A heat pipe and method that utilizes a multi-layered shape memory alloy (SMA) as the wick structure. Each layer has a different transformation temperature. The inner layer of the SMA begins contracting first when heat is applied along the surface of the heat pipe. The contraction reduces the effective capillary radius rc of the wick, thereby maintaining or increasing the capillary pumping pressure and thus the ability to remove heat. As the temperature of the heat pipe continues to rise, the outer layer begins contracting to reduce the capillary radius further. As a result, the local pumping pressure is maintained or even increased to accommodate higher local heat flux and remove the heat to prevent “dry-out.”

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.