Grinding and polishing machines
US6461228B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2000 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Jan 4, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a succession of workpieces have been ground, re-engaging the grinding wheel and the forming wheel with the grinding wheel remaining in situ, to re-form the groove in the grinding wheel to correct for wear. A grinding machine comprises a grinding wheel, drive means therefor, a workhead and workpiece spindle and drive means therefor, a forming wheel and drive means therefor, means for moving the grinding wheel so as to plunge grind the edge of the grinding wheel to form a groove therein of precise cross-section and means for effecting relative movement between the grinding wheel and the forming wheel to enable the grinding wheel to engage with the edge of a circular workpiece component mounted on the workpiece spindle to edge grind the component and wherein the forming wheel is also mounted on the workpiece spindle for rotation therewith, and the grinding wheel is a resin bonded wheel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.