Curable sealant composition
US6461691B1 · kind B1 · utility
16Cited by
10References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1999 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Nov 24, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation curable, flexible, paintable composition produced from epoxy compounds and one or more polyol(s) has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The composition can reduce, if not eliminate, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.